| 1. | Specification for flex - rigid multilayer printed boards with through connections
有贯穿连接的刚挠多层印制板规范 |
| 2. | Sectional specification - flex - rigid multilayer printed boards with through connections ; german version en 123600 : 1996
分规范.带贯通连接的弯曲刚性多层印制电路板 |
| 3. | Printed wiring boards - specification for flex - rigid multilayer printed boards with through connections
印制电路板.第11部分:贯穿连接的挠性-刚性多层印制电路板规范 |
| 4. | Printed boards ; part 11 : specification for flex - rigid multilayer printed boards with through connections
印制电路板.第11部分:有贯穿连接的弯曲刚性多层印制电路板规范 |
| 5. | System of quality assessment - sectional specification - flex - rigid multilayer printed boards with through - connections
质量评估体系.分规范.直通连接的软-硬性多层印制板 |
| 6. | System of quality assessment - capability detail specification - flex - rigid multilayer printed boards with through - connections
质量评估体系.性能的详细规范.直通连接的软-硬性多层印制板 |
| 7. | Printed boards ; part 11 : specification for flex - rigid multilayer printed boards with through connections ; identical with iec 60326 - 11 : 1991
印制电路板.第11部分:带贯穿连接的刚性弯曲多层印制 |
| 8. | Harmonized system of quality assessment for electronic components - sectional specification - flex - rigid multilayer printed boards with through connections
电子元器件质量评定协调体系.分规范.柔性-刚性多层连接印制电路板 |
| 9. | Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid multilayer printed boards with through connections
电子元器件用质量评估协调体系.性能详细规范:整体连接弯曲刚性多层印刷电路板 |
